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Equipment
  • 4He cryostat with electromagnet (1.3 < T < 300 K)
  • 3He insert (0.3 < T < 300 K)
  • Cryogen free cryostat (1.6 < T < 300 K)
  • Glovebox system
  • Electron beam evaporators & Ar milling system
  • DC and RF sputtering systems
  • Plasma etching system (O2 & CF4)
  • Atomic force, metallographic and optical microscopes
  • Mask aligner, spin coaters, scribers
  • Furnace
  • Wire bonder

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